Surface
Finishes
Hot Air Solder Level
Electroless Nickel / Immersion Gold
Immersion Tin
OSP's
Immersion Silver
Carbon Ink
Selective Hard Gold
Electrolytic Hard Gold
Electrolytic Soft Gold
Peelable Solder Mask
Direct
Immersion Gold on Copper
Lead
Free Hot Air Level
|
Via Fill
Conductive:
DuPont
CB100
Non-Conductive:
Hysol
1C
SAN-EI
PHP900IR-10F
Peters
PP2795 |